Job Summary:

Lead and manage SMT Engineering functions including equipment maintenance, failure analysis (FA), repair and debugging activities. Ensure high equipment uptime, fast issue resolution, and continuous yield improvement through data-driven problem solving, technical leadership, and close collaboration with Production, Quality, and Test teams.

Company Background:

Our client is a multinational cloud infrastructure technology company with a growing manufacturing footprint in Johor. The company provides advanced server and data center solutions to global customers and offers strong career growth in a stable, international environment.

Key Responsibilities

• Lead SMT engineering activities including equipment maintenance, failure analysis (FA), repair, and debugging operations.
• Ensure high equipment uptime, manufacturing efficiency, and smooth production support.
• Manage troubleshooting and root cause analysis for SMT, AOI, ICT, and FCT-related issues.
• Drive yield improvement, defect reduction, and product quality enhancement initiatives.
• Analyze defect trends and implement corrective and preventive actions (CAPA).
• Collaborate with Production, Quality, Test, and Process Engineering teams to resolve technical issues.
• Develop and maintain engineering procedures, repair standards, and troubleshooting guidelines.
• Lead continuous improvement projects to optimize processes, productivity, and operational performance.
• Manage, coach, and develop engineering and technical teams to strengthen technical capabilities.
• Monitor engineering KPIs and prepare performance reports for management review.

Job Requirements

• Bachelor's degree in Electronics / Electrical / Manufacturing Engineering or equivalent
• 8–12+ years in SMT/PCBA manufacturing
• Minimum 3–5 years in Repair / Debug / Failure Analysis leadership role
• Experience with: AOI / ICT / FCT failure analysis; High-mix or high-volume production
• Strong in: Circuit understanding & schematic reading; Debug tools (multimeter, oscilloscope); Rework equipment (BGA rework, soldering)
• Familiar with: IPC standards; MES / traceability systems; SPC / data analysis
• Strong execution mindset
• Cross-functional coordination ability
• Data-driven decision making
• Problem-solving (8D / 5Why / Fishbone)

Work Location: Senai, Johor

Salary Range: Up to RM22k