Job Summary

Lead and manage the SMT repair/debug operation to ensure fast turnaround, high repair yield, and closed-loop quality improvement, supporting overall factory yield, DPPM reduction, and shipment commitments.

Key Responsibilities

Main tasks:

• Repair & Automation Tool Implementation: Leverage repair data analysis tools to automate the generation of repair reports and facilitate preliminary defect classification.
• Cost Management: Manage the cost of repair consumables and implement strategies to reduce scrap rates caused by human error during the repair process.
• Customer Interaction & Communication: Proven experience in technical interfacing with internal teams/ customers, with the ability to explain Root Cause and Corrective Actions (RCCA) for quality issues effectively.
• Training & Leadership: Demonstrated ability to train, develop, and manage both the department staff and repair technicians to ensure operational excellence.

Repair Operation Management

• Manage daily repair station operations (post-SMT / post-AOI / post-ICT / post-FCT), Ensure:
• Repair turnaround time (TAT) meets target
• Repair WIP aging is controlled (no backlog > target)
• Set up clear repair flow:
• Incoming Diagnosis Repair Verification Closure
• Optimize manpower allocation based on line loading and defect trend

Yield & Quality Improvement

• Drive repair yield improvement (First Pass Repair Yield, Final Yield)
• Monitor:
• Top defect Pareto (daily / weekly)
• Repeat failures / chronic issues
• Lead root cause analysis (RCA) with cross-functional teams:
• Process Engineering
• Quality
• Test (ICT/FCT)
• Ensure zero escape of critical defects

Failure Analysis & Feedback Loop

• Ensure all failures are:
• Properly classified (Defect Dictionary standard)
• Logged into system (MES / Repair system)
• Establish strong feedback loop:
• Repair Engineering Production Supplier
• Escalate abnormal trends within same shift

Process Standardization

• Define and maintain:
• Repair SOPs / Work Instructions
• Standard repair methods (rework profile, component handling)
• Ensure compliance with:
• IPC standards (IPC-A-610 / IPC-7711/7721)
• Control:
• ESD
• Traceability
• Tooling calibration

Team Leadership & Capability Building

• Lead repair technicians and engineers
• Build multi-skill capability:
• Soldering / rework skill certification
• Debug capability (schematic reading, signal tracing)
• Set clear KPI for team:
• Productivity
• Accuracy
• Discipline
• Drive shopfloor discipline & execution speed

Data & Reporting

• Own and publish daily/weekly reports:
• Repair input/output
• Repair yield
• Top defects Pareto
• Aging WIP
• DPPM contribution
• Use data to:
• Identify top loss drivers
• Trigger immediate containment actions

Continuous Improvement

• Drive:
• Repair cycle time reduction
• False failure reduction (test vs real defect)
• NTF (No Trouble Found) / NDF reduction
• Participate in:
• NPI readiness (DFx feedback)
• Yield ramp-up activities
• Implement Lean / Six Sigma projects

KEY KPI

Operational

• Repair Turnaround Time (TAT)
• Repair WIP Aging (e.g., <24/48 hrs target)
• Productivity (units / man / shift)

Quality

• Repair Yield (FPY / Final Yield)
• Repeat defect rate
• Escape rate (post-repair failure)

Improvement

• Top defect reduction %
• DPPM contribution reduction
• NTF rate

Job Requirements

• Bachelor's degree in Electronics / Electrical / Manufacturing Engineering or equivalent
• 8–12+ years in SMT/PCBA manufacturing
• Minimum 3–5 years in Repair / Debug / Failure Analysis leadership role
• Experience with: AOI / ICT / FCT failure analysis; High-mix or high-volume production
• Strong in: Circuit understanding & schematic reading; Debug tools (multimeter, oscilloscope); Rework equipment (BGA rework, soldering)
• Familiar with: IPC standards; MES / traceability systems; SPC / data analysis
• Strong execution mindset 
• Cross-functional coordination ability
• Data-driven decision making
• Problem-solving (8D / 5Why / Fishbone)

Work Location: Senai, Johor

Salary Range: Up to RM22k